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Polyimide 'ej Representative Products application

SOLVER POLYIMIDE | Updated: Sep 15, 2014

(1) aerospace 'ej high-end cham. thermoplastic polyimide resin, nasa (usa nasa) jen speed aircraft, manufacturing nej tlham je rar pIm ghom imide synthetic polymer HaD. pa' reactive puS qIt ghom, wIv phenylethynyl ghom. because of overall nIvbogh yIqaw DuHIvDI' compounds bIquv, DeSDu' pa' Hat, polymer pov characteristics vor tIq puj storage ghaj. 80 vatlh DIS Qav working bertlham phenylethynyl imide oligomer, puS related wey such as National starchandchemicalcompany, qaStaHvIS tul HaD qettaHvIS akron ben DuSaQ'a'Daq DawI' SoH 'e' cham. chu' vatlh DIS poH supersonic aircraft (hsct), plane, raQpo' 300 qeng flight speed puS 2 poH speed wab, chavmoH yIn 60000 rep (ghot tu'lu'. mej 6.8 DIS), tlhoS 400 tons ngI' Hach nIpon american je. 'ach muHIvtaHbogh ghur porgh Hat ghur je aircraft speed ghor Hat ghot tu'lu'. mej 200 ℃-50 ℃. DeSDu' poH rap tlhap-DoH je muD landing Hub'eghtaHvIS flight 1 poH ghob'e' 'oH-50 ℃ 'ej 200 ℃ Hat cha' poH. wej lo' carbon fiber reinforced epoxy composites, vaj emerge (bmi) additive pi thermoplastic pi 'ej maleimide Hoch poQ poH. qay' composite thermal stress, SoQ 'eS thermal expansion pi potlh superiority. QaQDaq: semiconductor mIllogh qonwI' qoSta' je inorganic membrane moisture HIjmeH chaw' ①. wanI' rate Hoch HuSHa' inorganic membrane, laH overcome protective mIllogh qonwI' qoSta' semiconductor element, pe'vIl vaj pumDI' qoghlIj 'eS thermal expansion pi coating Hap 'u'. QI'yaH thermal stress storage je yoD mIllogh qonwI' qoSta' tIH elements alpha. Qo'noS ③ flexible printed circuit, tIj 'ach potlh lo' mIllogh qonwI' pi lang qoSta'. laH 'eS thermal expansion pi je pov yIqaw comprehensive foreknow, widely applied microelectronic cham aerospace yotlh je.

(2) microelectronics industry. PI je chu' Hap 'u' va 'ay' connection 'ej protection. recent DIS, in order to signal transmission speed yon, Qap requirements va circuit, Dub ghuS dielectric ru'Ha'wI' ghaj pi. reduced dielectric ru'Ha'wI' Sa' Homo, pa' range 3.0-3.5, requirement aromatic thermoplastic pi lang mIllogh qonwI' qoSta' below 2.5, tg lo'laHghach veb puS 400 ℃, mIllogh qonwI' qoSta' thickness neH 0.5-10 m. qaStaHvIS HaD pong pi nanofoam mIllogh qonwI' qoSta', in addition to poly propylene lo' oxide je lo' pmma, pms bIr mIw wIje'laHbe'chugh vaj (poly methoxy styrene) thermal decomposition polymers je. chenmoH pi nano foam mIllogh qonwI' qoSta' (diameter 8nm, pore 20 vatlhvI') dielectric ru'Ha'wI' neH 2.5 tlha' lom nolwI'pu', basic requirements ghom. qaStaHvIS addition, pi nano foam mIllogh qonwI' qoSta' wey ibm pi 'ej pov stability thermal 'ej bot polymer, decomposition copolymerization graft 'ej moj, dielectric ru'Ha'wI' 2.5 qup HoS, mIllogh qonwI' qoSta' thickness 0.5-10 μ m, foam porosity ghot tu'lu'. mej 20 vatlhvI', vIHtaHbogh diameter, 10nm 'ej laH nIS microelectronics industry ghom. 'ach nano pore Dej Dej (Dej) qay' vISangchu'Qo'chugh solved

(3) polyimide je 'eS coefficient thermal expansion. Dumerbe' Hap 'u' composite polymeric Hap 'u' baS, ceramics 'ej Hap inorganic latlh 'u' latlh nuv attention. 'ach taHtaHghach inorganic Hap 'u' Hap 'u' polymeric tuj resistance relatively vIvup, thermal expansion (cte) cha' vI'elta'bogh, Qatlh, along with Hat yoqvaD, tu'lu' thermal stress cracking composite Hap 'u' 'ej undesirable latlh wanI' coefficient. vaj qay' potlh pIm composite Hap 'u' pong thermal expansion coefficient difference luH thermal stress. law' ra'wI' qaStaHvIS polyimide polymer Hap 'u' pov yIqaw lo' DeSDu' poH rap, laH thermal expansion coefficient reduce, tIDIngmoH Dunmo' 'oH 'ej inorganic Hap 'u' composite je neH nuvpu'. polyamic pey (pa) taS woDlu'chugh mIllogh qonwI' qoSta' 210-6 ghap k Suq cte pa polymer ram Qu'maj mung je pa taS je vaj woDlu'chugh mIllogh qonwI' qoSta', DuD QaD imidization, blending, flexibility QaQ, pagh pe'vIl vaj pumDI' qoghlIj wanI'. loQ addition je laH lo' 'eS thermal expansion pi je puS cha' bIquv cha' amines cha' anhydride copolymer, mechanical copolymerization pat, ghaHmo' Dub additives baS tat, such as 4 vatlhvI'-30 vatlhvI' additive baS tat pi in addition to HIvje', baS DuDwI' Hap inorganic latlh 'u' je ngaS chel Sev, chel DuD je 'ach je because of si-oh Dabbogh Hoch'e' lang flexible.

(4) foam polyimide. wav polyimide foam Hap 'u' according to tlham vaj categories cha': thermosetting polyimide foam (such as bismaleimide (8 m 1), pmr Segh polyimide) 'ej thermoplastic polyimide foam. Hach polyimide foam Hap 'u' pong nasalangley Qul botlh, pa' partnership je unitikaamerica, baS widely lo' neH aircraft, qulmey, puH Duj, Duj etc. 'utmo' Dujvam: wa'DIch, tuj insulation 'ej wab insulation 'angbogh Da; DungDaj retardant, anti qul, pagh tlhIch, pagh joch SIp; foam ghu'vetlh according to jen, 'eS Hat requirements; choH; QaQ flexibility je elasticity. nanometer 'angbogh Da nano polyimide foam Hap 'u' physical 'ej chemical bang le' 'ej SuvwI' Qul Qu'mey potlh focus. DeSDu' jen yotlh such as oil qeq, aviation 'ej aerospace yotlh such as reconnaissance SIbDoH, missile nuH luch such as jen Hat resistant 'ay', widely lo' polyimide foam Hap 'u'.

vuS polyimide 'utmo' Dujvam qaStaHvIS Hat resistance, woj resistance, vaj mechanical yIqaw, far from petaQ HoHqang patlh polyimide tlham chav. meq 'elbogh polymer tIn vISov ghajbogh solubility synthetic cham rIntaH immaturity, imide method difference je cham DIng. jen HoS, jen modulus, jen ta' Hoch 'ay' attention all over qo' luH Hat resistant, woj resistant polyimide fiber 'ej latlh researchers jeS Qul development, baS chu' Sup forward qem Qul 'ej polyimide fiber development 'ej attract 'oH.

ghaH development automobile aerospace, especially electronics industry, pav requirement va luch miniaturization, lightweight, jen Qap development. pov polyimide bey' 'ej QuQ wa' laHmey naQ, leH rate nen DeSDu' around 10 vatlhvI'. DeSDu' SaH, development trend cha' benzene amine tlham latlh le' jonpIn mep alloy, pagh lIH in order to vISangchu'Qo'chugh tuj resistance Dub joq je pc, alloy pa latlh jonpIn mep 'ej mechanical HoS Dub.


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