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Polyimide common

SOLVER POLYIMIDE | Updated: Sep 15, 2014

(1) polyamide imide (Poly (amide-imide), amoco wey wa'DIch successful development commercialization 'ej pali. QaQ ablation resistance baS Hap 'u', jen adhesion, jen Hat 'ej jenwI' Se' electromagnetic chaq pai. color Hap 'u' tensile HoS 190mpa, flexural HoS 250mpa, 274 Hat thermal deformation load ℃ 1.8mpa. rewbe'mey'e' ngat luch, bearing, copier separation enhancement modification 'ej mep alloy pach, aircraft ablative Hap 'u', Hap 'u' magnetic 'ej structural Hap 'u';

(2) poly pyromellitic diimide, load Poly pyromellitic diimide (polypyromelitimide, pmma) 360 ℃ 1.8mpa neH 'ej Hat thermal deformation, bang electrical Dunmo' pai, HoS puj puS. laH lo' pmma mould mep neH precision 'ay', sealing SIQ Qeb piston, blower impeller, wa' bom vIqawbej, 'ej 'ay' etc contact je tIn mInDu'Daj 'ej boch ammonia valve 'ay', jet QuQ nIn supply pat le' je jenwI'-Hat Self-lubricating.;

(3) bismaleimide, bismaleimide ((bmi)) je maleimide je bifunctional chemical ghom, rav potlh thermosetting polyimide resin. mobility typical thermosetting resin moldability 'ej nagh ghaj. le' pi, bmi woj resistant je corrosion resistant bang qaStaHvIS jen Hat, resistance inherent leH DeSDu' poH rap puS pi Sa' mIw ngeD molding, 'eblIj 'Itlh composites matrix resin. vaj resin matrix tlham aviation aircraft tlham widely lo' je. 'ach disadvantages lang melting jen, vIvup solubility, Hat jen molding, chaq unmodify bmi vor Hap 'u' brittleness. bmi toughened diallyl bisphenol modify bmi resin resin mIw wa' 'ach successful, Sar nen, nuvpu' attention attracted je ngIm development application 'ej chav HochHom. kerrimid-601, DoyIchlan bottstechnochemic compimide-183 'ej 800 hexcelf-178, american, chinese logh 625 qy8911-1 'ej 5405 northwestern polytechnical ben DuSaQ'a'Daq DawI' SoH etc wey Qu'mey potlh bmi typical Sar french rhone-poudenc. in addition to bmi 'op chemical tlham nagh 'e' bmi 'ej bmi ghap ba pat, 'ej copolymerization npmi (n-phenyl maleimide). bmi resin 'Itlh aircraft successful development, jen yIqaw composite Hap 'u' DuHIvDI' 'elbogh load-bearing tlham. usa fourth puq poH fighter f-22, law' 24 vatlhvI' tlham, ngI' HochHom bogh bmi resin composite Hap 'u' jen toughness SIch Hap 'u' composite lo';

(4) america ge Hoch firstly Sar Hach jonpIn mep, QaQ bang comprehensive ghaj, vaj matrix QaQ Hap 'u' composite polyether imide, Polyether imide (polyetherimide, pei). development trend DaH introduction cha' benzene amine tlham latlh le' jonpIn mep alloy, tuj resistance Dub 'ej pagh je pc, pa 'ej mechanical HoS Dub alloy latlh jonpIn mep. pov bang mechanical, electrical insulation, resistance woj, ghaj zixi, resistance stalk moderate tuQ resistance; tet 'ej QaQ fluidity, 'eS mold shrinkage (0.5 vatlhvI'-0.7 vatlhvI' neH), ngeD post treatment. widely lo' pei electrical 'ej va, aerospace, automotive, medical luch 'ej latlh industries. qen pei prepreg tape launched america phoenixxtpc, pei ghap ultem Segh. reduce cost, voc (volatile organic compounds) eliminate prepreg processing wey phoenixx development mIw. solvent 'och tIq je Segh. laH widely lo' reinforce mep pa' petroleum, natural SIp, automotive, aerospace 'ej QI' yotlh qaStaHvIS prepreg fabric;

(5) poly amino bismaleimide, poly amino bismaleimide lo' (po lyam ino-b jIH smaleimide, pabm) pong DuD qeq 'ej products, jen tuj resistance laminated, laH lo' tIq poH DeSDu' 200 ℃, deformation Hat porghDaj moH 320 ℃ injection molding grade tuj HIvje' fiber reinforced; choH tangent tajvaj QaQ electrical bang, qaStaHvIS tev range Hat Se' dielectric loss je; friction resistance, friction coefficient 0.1-0.25, tuQ muq 0.002-0.04; pov resistance chemicals woj, 'ej laH resistant 108 gy woj, combustion ul94, LUT VAGH-Qu'vatlh patlh; laH lo' construction Hap 'u' nguSDI', aviation, automobile 'ay' 'ej woj resistant 'ay', rewbe'mey'e' lo' Hap 'u' jop SIQ, sliding piston rings, DevwI' tlhay valve jengva', 'ej etc SIQ. SeH pov comprehensive yIqaw, synthesis pathways, chaq pi method mIw 'ej laH widely lo' aviation, QInvam aerospace ghap electrical, pa' ghap Electronics latlh yotlh je. laH lo' jen permeability production permselectivity SIp separation membranes je, laH je lo' Duy arranged tIn mInDu'Daj 'ej boch qut arranged molecules vertically alignment 'ej maj photoresist etc patterned direct lithography vaj pi. loQ addition laH veb HoS je hardness Suq pi addition HIvje' fiber, graphite 'ej boron fiber, Hoch laH baS jet QuQ 'ay' ngaSwI' yuvtlhe' wIngaQmoHta'DI'. laH lo' Hap 'u' tuQ-resistant chel qaStaHvIS jen Hat resistant naDchu' etc manufacture.


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